Izdelki za stroji za rezanje (35)

Applications: - Laser cutting, dicing, and filamentation - Laser drilling – available as trepanning or percussion process - Laser micro structuring and ablation, e.g. with FSLA technology - Laser micro engraving, both on the substrate surface and as sub surface engraving in transparent materials Laser-Lift-Off (LLO) using DPSS laser and scanner systems Materials: ceramics, metals, polymers, glass materials, semiconductors, compound material

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.

The microMARK™ MCF is a premium engraving system. Using an UV excimer laser results in a superior engraving quality considering all cosmetic aspects – without any heat affection and micro cracks. The system is suitable for marking of all kinds of materials and coatings including highindex, tinted, and coated lenses. The microMARK™ MCF is the right choice for concave or convex as well as for blocked and unblocked lenses. The industryapproved system guarantees maximum throughput and availability. Premiumquality excimer laser marking Technical engraving and branding on all kinds of lenses and coatings UDI marking of hard and soft contact lenses Maximum throughput by automatic handling Superior availability by second laser source

3DMicromac‘s microSTRUCT™ C is a highly flexible laser micromachining system predominantly used in product development and applied research. Superior flexibility makes the system ideally suited for laser structuring, cutting, drilling and welding applications on a variety of substrates, e.g. metals, alloys, transparent and biological material, ceramics and thin film compound systems. The microSTRUCT™ C offers a maximal degree of freedom regarding the positioning of the substrates. Flexible, stable and repeatable machining results Two independent and free configurable working areas with various optical setups Open system concept for the integration of different laser sources High range of software functions (Masterscript) User friendly, flexible, upgradeable system

3DMicromac‘s microPRO™ is an adaptable laser micromachining system mainly used in industrial production. Its high versatility makes the system perfectly suited for industrial laser micromachining tasks such as laser structuring, cutting, and drilling applications. Furthermore, it is suitable for a variety of materials, e.g., metals, alloys, transparent and biological substrates, ceramics, and thin film compound systems. The microPRO™ is available with an automatic handling system for wafers, cassettes, trays, etc The microPRO™ enables the laser processing of various substrates. Due to the integration of different technology modules, the platform can be adapted to customers’ requirements. Configuration packages may include High speed cutting Drilling Engraving Structuring and modification Laser Lift Off (LLO) Cylindrical machining Customized solutions